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Capabilities

ItemStandardAdvanced
HDI type1+N+1 / 2+N+2 / 3+N+31+N+1 / 2+N+2 / 3+N+3
Min. laser drill110 µm80 µm
Laser drillingCO2 laserCO2 laser
MaterialFR4, halogen-free FR4FR4, Taconic, Rogers, others on request
Prepreg types106 / 1080 / 2116 / 1506 / 7628106 / 1037 / 1080 / 2116 / 1506 / 7628 / 1078 / 2113
Copper thickness12 / 18 / 35 / 70 / 350 µm9 / 12 / 18 / 35 / 70 / 105 / 350 µm
Min. track / space75 / 75 µm50 / 50 µm
Solder mask alignment± 38 µm± 25 µm
Min. solder mask bridge (green)60 µm50 µm
Solder mask coloursGreen, white, black, red, blueGreen, white, black, red, blue
Panel / board sizemin. 5 x 5 mm, max. 1200 x 500 mmmin. 5 x 5 mm, max. 1200 x 500 mm
Production panel size620 x 543 mm620 x 543 mm
Min. annular ring125 µm76 µm
Min. mechanical drill0.2 mm0.1 mm
Min. routing bit0.8 mm0.6 mm
Surface finishOSP, lead-free HASL, immersion tin, ENIG, plated Ni/Au, immersion silverSame
  • Lead times: prototypes 5 working days; mass production 10–12 working days.
  • Layer mix: double-layer 35%, single-layer 30%, multilayer 15%, aluminium 15%, HDI / flexible 5%.
  • Volumes: prototype, small, medium and large volume, mass production.

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